Synova SA

Unsere wichtigsten Marktleistungen

• Laser Cutting System (LCS)
  The LCS is a versatile tool conceived for micro cutting applications in a variety of applications and industrial sectors. The LCS may be equipped with a direct driven rotary axis and used for the manufacturing of tubes.
• Laser Dicing System (LDS)
  The Laser Dicing System is primarily designed for semiconductor wafer back-end processing. Processes include dicing, edge grinding, hole drilling, slotting, grooving, inking, isolating, and marking. The LDS is also used for the cutting of solar PV cells.
• Laser Stencil System (LSS)
  The Laser Stencil System is primarily designed for the cutting of stencils or metal masks used in the electronic industry and in the flat panel display sector in particular. The machine permits the handling of thin and large stencils with or without frame.